SYSTEM-IN-PACKAGE TECHNOLOGY-BASED PROCESS DESIGN METHOD AND SYSTEM, MEDIUM AND DEVICE

The present invention provides a system-in-package technology-based process design method and system, a medium and a device. The system-in-package technology-based process design method comprises: acquiring design data of a layout and three-dimensional model data associated with the layout; associating and matching the design data with the three-dimensional model data according to design element attribute information in the design data, and assembling the design data and the three-dimensional model data into an integrated packaging model; and performing assembly process analysis on the integrated packaging model to analyze unreasonable design points used as design modifications and references; or directly exporting, from the integrated packaging model, a packaging process manufacturing procedure for production and manufacturing. By means of the present invention, a lot of repetitive work can be removed, and manual work can be replaced by automation, thereby saving 60%-80% of the time compared with the original method; in addition, the working difficulty is reduced, and the process from design to simulation and production and manufacturing is simplified, greatly improving the competitiveness of electronic products.