POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT COMPRISING SAME

A polyamide resin composition of the present invention comprises: approximately 100 parts by weight of a polyamide resin comprising approximately 5 to 40 weight% of an aromatic polyamide resin and approximately 60 to 95 weight% of an aliphatic polyamide resin; approximately 30 to 70 parts by weight...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, Ho Geun, LEE, Sang Hwa, SEO, Yeong Deuk
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A polyamide resin composition of the present invention comprises: approximately 100 parts by weight of a polyamide resin comprising approximately 5 to 40 weight% of an aromatic polyamide resin and approximately 60 to 95 weight% of an aliphatic polyamide resin; approximately 30 to 70 parts by weight of an inorganic filler; and approximately 0.5 to 5 parts by weight of modified polyalkylene glycol. The modified polyalkylene glycol comprises an isocyanate group, a succinimide group or an epoxy group at one terminal of polyalkylene glycol. The polyamide resin composition exhibits excellent adhesiveness with other materials, excellent antifouling properties, impact resistance, stiffness, injection moldability and the like.