RESIN COMPOSITION AND MOLDED ARTICLE

Provided is a resin composition capable of producing a molded article that does not cause surface peeling and is excellent in tensile elongation at break and is also excellent in low dielectric properties. The resin composition contains an aromatic polyether ketone resin (I); and a fluorine-containi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SEKI, Toyomitsu, NAKANISHI, Koji, KONO, Hideki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a resin composition capable of producing a molded article that does not cause surface peeling and is excellent in tensile elongation at break and is also excellent in low dielectric properties. The resin composition contains an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measurement at 380°C and a load of 5000 g and with a preheating time of five minutes in conformity with ASTM D1238.