FLEX-RIGID SENSOR ARRAY STRUCTURE FOR ROBOTIC SYSTEMS

A flex-rigid sensor apparatus for providing sensor data from sensors disposed on an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus includes piezo-type pressure sensors sandwiched between lower and upper PCB stack-up structures respectively fabricated using r...

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Bibliographische Detailangaben
Hauptverfasser:	PAULSON, Christopher A, CASSE, Bernard D, SHAFFER, Matthew E, SMITH, Clinton J, KERALY, Christopher Lalau
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC ORINFRASONIC WAVES MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS TARIFF METERING APPARATUS TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A flex-rigid sensor apparatus for providing sensor data from sensors disposed on an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus includes piezo-type pressure sensors sandwiched between lower and upper PCB stack-up structures respectively fabricated using rigid PCB (e.g., FR-4) and flexible PCB (e.g., polyimide) manufacturing processes. Additional (e.g., temperature and proximity) sensors are mounted on the upper/flexible stack-up structure. A spacer structure is disposed between the two stack-up structures and includes an insulating material layer defining openings that accommodate the pressure sensors. Copper film layers are configured to provide Faraday cages around each pressure sensor. The pressure sensors, additional sensors and Faraday cages are connected to sensor data processing and control circuitry (e.g., analog-to-digital converter circuits) by way of signal traces formed in the lower and upper stack-up structures and in the spacer structure. An encapsulation layer is formed on the upper PCB stack-up structure.