METHOD OF MANUFACTURING HEAD CHIP AND METHOD OF MANUFACTURING LIQUID JET HEAD
There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The met...
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| creator | KUBOTA, Yuzuru IROKAWA, Daiki MUNAKATA, Suguru NAKAMURA, Yuji |
| description | There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip (41) is a method of manufacturing a head chip (41) having an actuator plate (411) adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves (C1d, C1e) on a surface of a piezoelectric substrate (411Z) having one end (411E1) and the other end (411E2) so as to extend from the one end side toward the other end side, forming a conductive film (F) on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area (LA) in the conductive film between the grooves adjacent to each other by performing laser processing from a start point (Ps) on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed. |
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The method of manufacturing a head chip (41) is a method of manufacturing a head chip (41) having an actuator plate (411) adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves (C1d, C1e) on a surface of a piezoelectric substrate (411Z) having one end (411E1) and the other end (411E2) so as to extend from the one end side toward the other end side, forming a conductive film (F) on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area (LA) in the conductive film between the grooves adjacent to each other by performing laser processing from a start point (Ps) on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.</description><language>eng ; fre ; ger</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230712&DB=EPODOC&CC=EP&NR=3939790B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230712&DB=EPODOC&CC=EP&NR=3939790B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUBOTA, Yuzuru</creatorcontrib><creatorcontrib>IROKAWA, Daiki</creatorcontrib><creatorcontrib>MUNAKATA, Suguru</creatorcontrib><creatorcontrib>NAKAMURA, Yuji</creatorcontrib><title>METHOD OF MANUFACTURING HEAD CHIP AND METHOD OF MANUFACTURING LIQUID JET HEAD</title><description>There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip (41) is a method of manufacturing a head chip (41) having an actuator plate (411) adapted to apply pressure to liquid so as to jet the liquid. 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The method of manufacturing a head chip (41) is a method of manufacturing a head chip (41) having an actuator plate (411) adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves (C1d, C1e) on a surface of a piezoelectric substrate (411Z) having one end (411E1) and the other end (411E2) so as to extend from the one end side toward the other end side, forming a conductive film (F) on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area (LA) in the conductive film between the grooves adjacent to each other by performing laser processing from a start point (Ps) on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | METHOD OF MANUFACTURING HEAD CHIP AND METHOD OF MANUFACTURING LIQUID JET HEAD |
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