SOLVENT-LESS IONIC LIQUID EPOXY RESIN

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R1-(Y1)n), wherein R1 is an ionic moiety, Y1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a...

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Bibliographische Detailangaben
Hauptverfasser:	FRIESEN, Cody, GONCHARENKO, Mykhaylo, BAUTISTA-MARTINEZ, Jose, Antonio, JOHNSON, Paul
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R1-(Y1)n), wherein R1 is an ionic moiety, Y1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (R2-Z1)n), wherein R2 is an ionic moiety, Z1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.