LASER PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME

Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributi...

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Bibliographische Detailangaben
Hauptverfasser: UNRATH, Mark, YANG, Chuan, LOTT, Geoffrey, FINN, Daragh, KLEINERT, Jan, LIN, Zhibin, HU, Honghua, SCHRAUBEN, Joel, CHEN, Ruolin
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.