SENSOR

In a sensor for which a metal lid is adhered to a metal case, it is possible to improve heat dissipation. This sensor 1 comprises: a metal case 10 that houses a circuit board 40 electrically connected to a sensor element, and for which are provided an opening 15 and an edge part 11 that defines the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIYATA, Tsuyoshi, OHARA, Hidekazu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RELAYS SELECTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In a sensor for which a metal lid is adhered to a metal case, it is possible to improve heat dissipation. This sensor 1 comprises: a metal case 10 that houses a circuit board 40 electrically connected to a sensor element, and for which are provided an opening 15 and an edge part 11 that defines the opening 15; and a metal lid 20 that is adhered to the edge part 11 so as to cover the opening 15. One or more recesses 14 are provided on at least one of the edge part 11 and the metal lid 20, and the metal lid 20 is adhered to the edge part 11 by the portion of an adhesive agent 50 filled inside the recess 14 that is positioned at the area of the open end of the recess 14.