METHOD OF FABRICATING A DEVICE COMPRISING AN ELECTRICAL COMPONENT WITH SUB COMPONENTS CONNECTED USING A PLATE TO CONTROL AN ELECTRICAL PARAMETER
A method of fabricating a device comprising at least one electrical component (101) comprising:- forming, above a substrate (102), a plurality of sub-components (C1, ..., C4) each having a top electrode,- measuring an actual value of an electrical parameter of at least one sub-component of the plura...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method of fabricating a device comprising at least one electrical component (101) comprising:- forming, above a substrate (102), a plurality of sub-components (C1, ..., C4) each having a top electrode,- measuring an actual value of an electrical parameter of at least one sub-component of the plurality of sub-components,- forming a conductive plate (104) for connecting together the top electrodes of sub-components of a group of selected sub-components belonging to the plurality of sub-components so as to form the electrical component having a value of the electrical parameter which approximates a desired value, by taking into account the actual value of the at least one sub-component.The invention also concerns the corresponding device. |
---|