ELECTRONIC ASSEMBLY WITH HEAT SINKS

An electronic assembly comprises a semiconductor device (48) that has conductive pads (66) on a semiconductor first side (72) and a metallic region (266) on a semiconductor second side (74) opposite the first side (72). A lead frame (16) provides respective separate terminals (54, 56) that are elect...

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Bibliographische Detailangaben
Hauptverfasser:	CLEMENTS, Neal D, SINGH, Brij N, ROAN, Thomas, WIELAND, Andrew D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electronic assembly comprises a semiconductor device (48) that has conductive pads (66) on a semiconductor first side (72) and a metallic region (266) on a semiconductor second side (74) opposite the first side (72). A lead frame (16) provides respective separate terminals (54, 56) that are electrically and mechanically connected to corresponding conductive pads. A first heat sink (30) comprises a first component (37) having a mating side (62). A portion of the mating side (62) is directly bonded with the metallic region (266) of the semiconductor device (48). A circuit board has an opening for receiving the semiconductor device (48). The lead frame (16) extends outward toward the circuit board or a board first side of the circuit board.