AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILM

An Ag alloy sputtering target includes Mg in a range of more than 1.0 atom% and 5.0 atom% or less, Pd in a range of more than 0.10 atom% and 2.00 atom% or less, and a balance consisting of Ag and inevitable impurities. The Ag alloy sputtering target may further include 0.10 atom% or more of Au, and...

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Hauptverfasser: NONAKA, Sohei, TOSHIMORI, Yuto
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creator NONAKA, Sohei
TOSHIMORI, Yuto
description An Ag alloy sputtering target includes Mg in a range of more than 1.0 atom% and 5.0 atom% or less, Pd in a range of more than 0.10 atom% and 2.00 atom% or less, and a balance consisting of Ag and inevitable impurities. The Ag alloy sputtering target may further include 0.10 atom% or more of Au, and a total content of Au and Pd may be set to 5.00 atom% or less. The Ag alloy sputtering target may further include Ca in a range of 0.01 atom% or more and 0.15 atom% or less. In addition, the oxygen content may be 0.010 % by mass or less.
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The Ag alloy sputtering target may further include 0.10 atom% or more of Au, and a total content of Au and Pd may be set to 5.00 atom% or less. The Ag alloy sputtering target may further include Ca in a range of 0.01 atom% or more and 0.15 atom% or less. 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language eng ; fre ; ger
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subjects ALLOYS
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
FERROUS OR NON-FERROUS ALLOYS
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TREATMENT OF ALLOYS OR NON-FERROUS METALS
title AG ALLOY SPUTTERING TARGET, AND AG ALLOY FILM
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