FAST CURE EPOXY RESIN COMPOSITIONS

Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100°...

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Bibliographische Detailangaben
1. Verfasser: ASPIN, Ian
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100°C to about 130°C to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.