METHOD OF FORMING MOISTURE AND OXYGEN BARRIER COATINGS

Embodiments of the present invention generally relate to methods of forming moisture and oxygen barrier films on substrates. A barrier layer is deposited on a substrate in an atomic layer deposition chamber using atomic layer deposition to reduce a water vapor transmission rate and an oxygen transmi...

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Bibliographische Detailangaben
Hauptverfasser:	BRITZ, David, BAJAJ, Geetika, THAKARE, Darshan, GORADIA, Prerna Sonthalia, GANAPATHIAPPAN, Sivapackia
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DIFFUSION TREATMENT OF METALLIC MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments of the present invention generally relate to methods of forming moisture and oxygen barrier films on substrates. A barrier layer is deposited on a substrate in an atomic layer deposition chamber using atomic layer deposition to reduce a water vapor transmission rate and an oxygen transmission rate of the substrate. The barrier layer is deposited at 1 atm and at a temperature between about 25 degrees Celsius to about 5 degrees Celsius below a melting point of the substrate. The substrate may be optionally plasma treated prior to depositing the barrier layer to enhance the adhesion of the barrier layer to the substrate. One or more additional layers, such as layers comprising polymers, may be deposited on the barrier layer to further reduce the water vapor transmission rate and/or the oxygen transmission rate.