FILMS FOR USE AS INTERLEAVES BETWEEN SUBSTRATES

A film for use as an interleaf between substrates includes a first side having a first micro-embossed surface and a first formed pattern, a second side having a second micro-embossed surface and a second formed pattern, a basis weight of between about 35 gsm and about 80 gsm, a Low Load Thickness of...

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Bibliographische Detailangaben
Hauptverfasser: DESAI, Bankim Bhupendra, RAY, Carl Douglas
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A film for use as an interleaf between substrates includes a first side having a first micro-embossed surface and a first formed pattern, a second side having a second micro-embossed surface and a second formed pattern, a basis weight of between about 35 gsm and about 80 gsm, a Low Load Thickness of between about 150 micrometers and 400 micrometers according to the Low Load Thickness Test, and a flexural stiffness of between about 150 grams and about 500 grams according to the Circular Bend Stiffness Test.