METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY ON A 3D PART

A method of applying an electronic assembly on a 3D part made of a polypropylene-based material, the electronic assembly comprising at least one electrically conductive path having width between 0.1 and 4 mm, the method comprising: providing a 3D part made of a polypropylene-based material; selecting a conductive paste (128) comprising: metallic particles comprising silver, a binder and an organic solvent; the amount of binder being between 1 to 5 wt%; the amount of metallic particles being between 74 to 90 wt%, the metallic particles having an average size between 50nm to 50µm; wherein the viscosity of the conductive paste is between 75 and 425 Pa-s measured with a rheometer at a temperature of 25°C at 1/s shear rate; providing a fluid dispensing system (11) for applying the conductive paste (128) onto a surface of the 3D part; selecting and attaching a nozzle (125) to the fluid dispensing system (11), through which the selected conductive paste is to be dispensed, wherein the nozzle (125) is selected such that its inner diameter is as close as possible to the width of the conductive path to be applied, the inner diameter of the nozzle (125) being smaller than the width of the conductive path to be applied; dispensing the selected conductive paste (128) on to the surface of the 3D part through said nozzle (125) by applying a pressure between 0.2 and 13 bar, while maintaining a maximum distance of 900 µm between the nozzle (125) and the surface of the 3D part; curing the deposited conductive paste; depositing a dielectric ink on the printed conductive path; curing the deposited dielectric ink; attaching at least one electronic component on the conductive path.