SPRING LOADED COMPLIANT COOLANT DISTRIBUTION MANIFOLD FOR DIRECT LIQUID COOLED MODULES

Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.