COMPRESSION-LOADED PRINTED CIRCUIT ASSEMBLY FOR SOLDER DEFECT MITIGATION

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit ("ASIC") ball grid array ("BGA") package during the rework or secondary reflow process. The compression-loading assembly (500) may include a top...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO, Shinnosuke, TENG, Sue Yun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit ("ASIC") ball grid array ("BGA") package during the rework or secondary reflow process. The compression-loading assembly (500) may include a top plate (340) and a compression plate (354). The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms (350). The compression mechanisms may each include a bolt (352) and a spring (462). The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.