HIGHLY HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM

Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a...

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Bibliographische Detailangaben
Hauptverfasser: ANDOH, Hideki, MUKUDAI, Jun, TAKAHASHI, Hiroyuki
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass% and a proportion of the polyamide resin (B) is 10 to 50 mass% relative to a total amount of 100 mass% of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1) which is calculated from a tensile modulus (M) at 80°C relative to a tensile modulus (Mo) at 23°C is 50% or more, with the dumbbell test piece being obtained by subjecting the thermoplastic resin composition to injection molding, and a molded article manufactured therefrom is also provided. Tensilemodulusretentionrate%=MtensilemodulusMPaat80°C/MotensilemodulusMPaat23°C×100.