ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising(i) copper (II) ions,(ii) one or more than one suppressor consisting of or comprising- one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms a...
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| creator | Palm, Jens Schmidt, Ralf Jha, Himendra Rohland, Willi Gaida, Josef |
| description | The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising(i) copper (II) ions,(ii) one or more than one suppressor consisting of or comprising- one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and one or more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises- one or more than one linear or branched polyalkylene glycol moiety,and/or- one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety,with the proviso that- if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and- said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above. |
| format | Patent |
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and specific suppressors as defined above.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>HETEROCYCLIC COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC CHEMISTRY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB2dPZ08XRWcAwMdfUPDVZw9vcN8A_2DPH091Nw8w9ScPVxdQ4J8veJDPF0dvTxiVRwcYXI-7krOAJVBwS4BsHEeBhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJvGuAsaWBobGxoaOhMRFKAGFkLZo</recordid><startdate>20211027</startdate><enddate>20211027</enddate><creator>Palm, Jens</creator><creator>Schmidt, Ralf</creator><creator>Jha, Himendra</creator><creator>Rohland, Willi</creator><creator>Gaida, Josef</creator><scope>EVB</scope></search><sort><creationdate>20211027</creationdate><title>ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT</title><author>Palm, Jens ; Schmidt, Ralf ; Jha, Himendra ; Rohland, Willi ; Gaida, Josef</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3901331A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>HETEROCYCLIC COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC CHEMISTRY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Palm, Jens</creatorcontrib><creatorcontrib>Schmidt, Ralf</creatorcontrib><creatorcontrib>Jha, Himendra</creatorcontrib><creatorcontrib>Rohland, Willi</creatorcontrib><creatorcontrib>Gaida, Josef</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Palm, Jens</au><au>Schmidt, Ralf</au><au>Jha, Himendra</au><au>Rohland, Willi</au><au>Gaida, Josef</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT</title><date>2021-10-27</date><risdate>2021</risdate><abstract>The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising(i) copper (II) ions,(ii) one or more than one suppressor consisting of or comprising- one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and one or more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises- one or more than one linear or branched polyalkylene glycol moiety,and/or- one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety,with the proviso that- if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and- said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES HETEROCYCLIC COMPOUNDS METALLURGY ORGANIC CHEMISTRY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT |
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