ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT

The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising(i) copper (II) ions,(ii) one or more than one suppressor consisting of or comprising- one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and one or more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises- one or more than one linear or branched polyalkylene glycol moiety,and/or- one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety,with the proviso that- if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and- said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms;a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above.