SOUND PRODUCING PACKAGE STRUCTURE AND METHOD FOR PACKAGING SOUND PRODUCING PACKAGE STRUCTURE

A sound producing package structure (PAS) configured to produce sound includes a substrate (SB), a sound producing component (PC) and a conductive adhesive layer (CAL). The sound producing component (PC) is disposed on the substrate (SB), and the sound producing component (PC) is configured to gener...

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Bibliographische Detailangaben
Hauptverfasser:	Wen, Hai-Hung, Lo, Chiung C, Liang, Jemm Yue
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	A sound producing package structure (PAS) configured to produce sound includes a substrate (SB), a sound producing component (PC) and a conductive adhesive layer (CAL). The sound producing component (PC) is disposed on the substrate (SB), and the sound producing component (PC) is configured to generate an acoustic wave corresponding to an input audio signal. The conductive adhesive layer (CAL) is disposed between the substrate (SB) and the sound producing component (PC). The conductive adhesive layer (CAL) is formed via a surface mount technology, and each material contained in the sound producing component (PC) has a heat resistant temperature higher than a process temperature of the surface mount technology.