MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

A multilayer structure (100), comprising a flexible substrate film (102) having a first side and opposite second side, a number of conductive traces (108), optionally defining contact pads and/or conductors, preferably printed on the first side of the substrate film for establishing a desired predetermined circuit design, plastic layer (104) molded onto the first side of the substrate film (102) so as to enclose the circuit between the plastic layer and the first side of the substrate film (102), and a preferably flexible connector (114) for providing external electrical connection to the embedded circuit on the first side from the second, opposite side of the substrate film (102), one end of the connector being attached to a predetermined contact area on the first side whereas the other end (114B) is located on the second side of the substrate for coupling with an external element (118), the intermediate portion connecting the two ends being fed through an opening (115) in the substrate, wherein the opening extending through the thickness of the substrate film is preferably dimensioned so as to accommodate the connector without substantial additional clearance. A corresponding method of manufacture is presented.