LIGHT EMITTING ELEMENT AND LIGHT EMITTING MODULE COMPRISING SAME

LIGHT EMITTING ELEMENT AND LIGHT EMITTING MODULE COMPRISING SAME

A light emitting module may include a mounting substrate, a plurality of light emitting chips and a plurality of conductive adhesion parts. Each of the light emitting chips may include: a first substrate; a first light emitting unit; a second substrate isolated from the first substrate; and a second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Kyoung Wan, LEE, Jin Woong
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A light emitting module may include a mounting substrate, a plurality of light emitting chips and a plurality of conductive adhesion parts. Each of the light emitting chips may include: a first substrate; a first light emitting unit; a second substrate isolated from the first substrate; and a second light emitting unit. One side surface of the first substrate may include a first modified surface, and one side surface of the second substrate, facing the one side surface of the first substrate, may include a second modified surface. The first modified surface may include modified regions extended in the thickness direction of the first substrate and ruptured regions disposed between the respective modified regions, and the second modified surface may include modified regions extended in the thickness direction of the second substrate and ruptured regions disposed between the respective modified regions.