PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL MOLDING METHOD USING SAME, AND THREE-DIMENSIONAL MOLDED PRODUCT

[Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short pe...

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Bibliographische Detailangaben
Hauptverfasser:	KUNIHIRO Yoshio, ISHIMARU Yuya, KIYOSADA Toshitsugu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	[Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short period of time.[Solution] A photo-curable resin composition having a viscosity at 20 °C of 0.2 Pa·s or more and a viscosity at 150 °C of 1000 Pa·s or less was found.