PROTECTIVE FILM FORMING AGENT FOR PLASMA DICING AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Provided are: a protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma di...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | Provided are: a protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent for plasma dicing. The protective film forming agent for plasma dicing comprises a water-soluble resin (A), a light absorber (B), and a solvent (S), wherein a weight loss rate in a case of raising temperature to 500°C in thermogravimetry of the water-soluble resin (A) is at least 80 weight%. |
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