CONDUCTIVE SUBSTRATE HAVING METAL WIRING, METHOD FOR MANUFACTURING SAID CONDUCTIVE SUBSTRATE, AND METAL INK FOR FORMING METAL WIRING

The present invention relates to an electroconductive substrate including a base material and a metal wiring made of at least either of silver and copper, and the electroconductive substrate has an antireflection region formed on part or all of the metal wiring surface. This antireflection region is composed of roughened particles made of at least either of silver and copper and blackened particles finer than the roughened particles and embedded between the roughened particles. The blackened particles are made of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25 wt% or more. Then, the antireflection region has a surface with a center line average roughness of 15 nm or more and 70 nm or less. The present inventive electroconductive substrate is produced by forming a metal wiring from an metal ink that forms roughened particles, followed by application together with a blackening ink containing blackened particles. The metal wiring on the electroconductive substrate of the present invention has suppressed light reflection, and its presence is hard to view.