METHOD FOR PRODUCING A PLURALITY OF RADIATION-EMITTING COMPONENTS, RADIATION-EMITTING COMPONENT, METHOD FOR PRODUCING A CONNECTION CARRIER, AND CONNECTION CARRIER

METHOD FOR PRODUCING A PLURALITY OF RADIATION-EMITTING COMPONENTS, RADIATION-EMITTING COMPONENT, METHOD FOR PRODUCING A CONNECTION CARRIER, AND CONNECTION CARRIER

A method of producing a plurality of radiation-emitting components includes providing a composite with a plurality of connection carriers, wherein each connection carrier includes a light-transmissive matrix in which vias are arranged extending therethrough from a first main surface of the connectio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WITTMANN, Sebastian, PERZLMAIER, Korbinian
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ADVERTISING
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method of producing a plurality of radiation-emitting components includes providing a composite with a plurality of connection carriers, wherein each connection carrier includes a light-transmissive matrix in which vias are arranged extending therethrough from a first main surface of the connection carrier to a second main surface of the connection carrier, and the connection carriers are spaced from each other by frames surrounding each connection carrier, arranging a radiation-emitting semiconductor chip on two vias, and separating the components by removing all or part of the frames.