ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER

ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with th...

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Bibliographische Detailangaben
Hauptverfasser: Jaussi, James, Parthasarathy, Bharadwaj, Deshpande, Nitin A, Alduino, Andrew C, Liljeberg, Thomas, Liao, Ling, Mahajan, Ravindranath Vithal, Brown, Kenneth
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
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Beschreibung
Zusammenfassung:Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.