FLUX, METHOD FOR APPLYING FLUX, AND METHOD FOR MOUNTING SOLDER BALL

Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass% of a solid solvent having a melting point of 60°C or less, 50-80 mass% of a solvent, 5-10 mass% of an organic acid, 10-30 mass% of an amine, a...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIZAKI Takahiro, KAWASAKI Hiroyoshi, FUKUYAMA Naoaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass% of a solid solvent having a melting point of 60°C or less, 50-80 mass% of a solvent, 5-10 mass% of an organic acid, 10-30 mass% of an amine, and 0-5 mass% of a halide, the flux forming a liquid having a high viscosity of 5 Pa·s or higher at 25°C, and forming a liquid having a low viscosity of 50 mPa·s or less at 100°C.