METHOD OF MANUFACTURING AN ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER

The present invention relates to a method of manufacturing a semiconductor package, which is at least in part covered by an electromagnetic interference shielding layer, comprising at least these steps: i. Providing the semiconductor package and an ink composition; wherein the ink composition compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MURIEL, Thomas, BEHL, Susanne, ULLAND, Holger, NEUMANN, Christian, BOLDT, Kai, KRÄMER, Peter
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to a method of manufacturing a semiconductor package, which is at least in part covered by an electromagnetic interference shielding layer, comprising at least these steps: i. Providing the semiconductor package and an ink composition; wherein the ink composition comprises at least these constituents: a) A compound comprising at least one metal precursor; b) At least one organic compound; and ii. Applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; iii. Treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm, and to a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. The present invention relates also to a semiconductor package comprising a electromagnetic interference shielding layer, wherein the specific conductance of the first layer of electromagnetic interference shielding material is in the range from 5 to 90 % of bulk metal; and wherein the thickness of the first layer of electromagnetic interference shielding material is in the range from 5 nm to 5 µm. The present invention relates further to some uses of an ink composition.