DOUBLE-SIDE PCB SIP ASSEMBLY

A System-In-Package (SiP) comprises a double-sided PCB with an upper PCB surface, on which upper electrical PCB components are assembled, and a bottom PCB surface, on which bottom electrical PCB components are assembled. At least one spacer substrate is arranged together with the bottom electrical PCB components on the bottom PCB surface, wherein an upper spacer surface of the spacer substrate is mechanically and electrically coupled to the bottom PCB surface, and wherein a bottom spacer surface of the spacer substrate comprises a mounting structure for mounting the PCB assembly to a mainboard PCB and extends in a predefined spacing distance along at least part of the upper spacer surface. The spacer substrate is configured such that, when the PCB assembly is mounted onto a mainboard PCB, the spacer substrate spaces the bottom electrical PCB components from the mainboard PCB.