COOLING PROFILE INTEGRATION FOR EMBEDDED POWER SYSTEMS

The present invention relates to a component carrier (100) comprising a stack (101) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component (102) embedded in the stack (101); a first thermally conductive block (103) abo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Drofenik, Dietmar, Frauwallner, Rainer, Fleischhacker, Patrick
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a component carrier (100) comprising a stack (101) comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component (102) embedded in the stack (101); a first thermally conductive block (103) above and thermally connected with the component (102), and a second thermally conductive block (104) below and thermally coupled with the component (102). The heat generated by the component (102) during operation is removed via at least one of the first thermally conductive block (103) and the second thermally conductive block (104).