CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC

[Problem] To provide a curable organopolysiloxane composition having rheological properties suitable for precision application and fine pattern formation by a fine droplet coating apparatus such as a jet dispenser, along with a method for forming a pattern using the same.[Resolution Means] The prese...

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Bibliographische Detailangaben
Hauptverfasser:	TODA Nohno, SUTOH Manabu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	[Problem] To provide a curable organopolysiloxane composition having rheological properties suitable for precision application and fine pattern formation by a fine droplet coating apparatus such as a jet dispenser, along with a method for forming a pattern using the same.[Resolution Means] The present invention is suitably: a curable organopolysiloxane composition, which is hydrosilylation reaction curable and precisely applied by a jet dispenser, etc., wherein the viscosity at a strain speed of 1,000 (1/s) is 2.0 Pa s or less, while the viscosity at a strain speed of 0.1 (1/s) is a value 50.0-fold or more the viscosity at a strain speed of 1,000 (1/s), and wherein the content of silicon atom-bonded aromatic functional groups in the composition is within a range of 1.0 to 6.0 mass%; a method for forming a pattern using the same; and an electronic component using the same, etc.