RESIN COMPOSITION
An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used in the manufacture of electronic components.The resin composit...
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| creator | SATO Ayako ARAI Fuminori |
| description | An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used in the manufacture of electronic components.The resin composition of the present invention contains (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator containing at least one basic substance, and (c) an anionic polymerization inhibitor containing at least one borate ester compound. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | RESIN COMPOSITION |
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