RESIN COMPOSITION

An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used in the manufacture of electronic components.The resin composit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO Ayako, ARAI Fuminori
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a resin composition that can be manufactured consistently with reduced variability in properties and leads to improved productivity and that is suitable for use as a one-part adhesive used in the manufacture of electronic components.The resin composition of the present invention contains (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator containing at least one basic substance, and (c) an anionic polymerization inhibitor containing at least one borate ester compound.