SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME

The application relates to a semiconductor die (1), having a semiconductor body (2) comprising an active region (3), an insulation layer (4) formed on the semiconductor body (2), a sodium stopper (5) formed in the insulation layer (4), the sodium stopper (5) being arranged in an insulation layer gro...

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Hauptverfasser: NEUMANN, Ingmar, BLANK, Oliver, ALTSTAETTER, Christof
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Sprache:eng ; fre ; ger
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creator NEUMANN, Ingmar
BLANK, Oliver
ALTSTAETTER, Christof
description The application relates to a semiconductor die (1), having a semiconductor body (2) comprising an active region (3), an insulation layer (4) formed on the semiconductor body (2), a sodium stopper (5) formed in the insulation layer (4), the sodium stopper (5) being arranged in an insulation layer groove (20), which intersects the insulation layer (4) vertically and extends around the active region (3), wherein the sodium stopper (5) is formed of a tungsten material (15) filling the insulation layer groove (20).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME
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