SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING THE SAME
The application relates to a semiconductor die (1), having a semiconductor body (2) comprising an active region (3), an insulation layer (4) formed on the semiconductor body (2), a sodium stopper (5) formed in the insulation layer (4), the sodium stopper (5) being arranged in an insulation layer gro...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The application relates to a semiconductor die (1), having a semiconductor body (2) comprising an active region (3), an insulation layer (4) formed on the semiconductor body (2), a sodium stopper (5) formed in the insulation layer (4), the sodium stopper (5) being arranged in an insulation layer groove (20), which intersects the insulation layer (4) vertically and extends around the active region (3), wherein the sodium stopper (5) is formed of a tungsten material (15) filling the insulation layer groove (20). |
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