PARTICLES FOR JOINING MATERIAL AND PRODUCTION METHOD THEREOF, JOINING PASTE AND PREPARATION METHOD THEREOF, AND PRODUCTION METHOD OF JOINED BODY

PARTICLES FOR JOINING MATERIAL AND PRODUCTION METHOD THEREOF, JOINING PASTE AND PREPARATION METHOD THEREOF, AND PRODUCTION METHOD OF JOINED BODY

Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m2/g to 8 m2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a rang...

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Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI, Tomohiko, HIGAMI, Akihiro, OTOGAWA, Kohei
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CONDUCTORS
ELECTRICITY
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m2/g to 8 m2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a range of 0.5% to 2.0% by mass with respect to the particles for joining material. When the particles for joining material are analyzed by using the Time-Of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) method, respective detected amounts of C3H4O2- ions and C3H4O2- ions are in a range of 0.05 times to 0.2 times a detected amount of Cu+ ions, and a detected amount of ions of C5 or more is in a range less than 0.005 times the detected amount of Cu+ ions.