COMPONENT CARRIER WITH EMBEDDED COMPONENT EXPOSED BY BLIND HOLE

A method of manufacturing a component carrier (100), wherein the method comprises providing a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), embedding a component (108) in the stack (102), drilling...

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Bibliographische Detailangaben
Hauptverfasser:	Tuominen, Mikael, Tay, Seok Kim
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of manufacturing a component carrier (100), wherein the method comprises providing a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), embedding a component (108) in the stack (102), drilling a blind hole (110) in the stack (102) towards the embedded component (108), and thereafter extending the blind hole (110) by etching to thereby expose a surface portion (112) of the embedded component (108).