WAFER BREAKING DEVICE, INVERTING DEVICE, AND CONVEYANCE SYSTEM

A wafer breaking apparatus 1 including: a scribe unit 20 configured to form a scribe line on a surface WA of a wafer W; a film laminating unit 30 configured to attach a film 31 to the surface WA, of the wafer W, on which the scribe line has been formed; an inverting unit 100 configured to invert the W wafer such that a face thereof to which the film 31 has been attached is on a lower side; a break unit 40 configured to break the wafer W along the scribe line by applying a predetermined force to a face, of the wafer, to which the film 31 has not been attached; and a conveyance part 200 configured to convey the wafer W to a predetermined position, wherein the film laminating unit 30 is disposed at a position separated in a vertical direction from the inverting unit 100.