OVERMOLDED OPTICAL CIRCUITS

A method of preparing an overmolded optical fiber assembly (150) comprising: (a) placing at least one flexible optical circuit (880) in a bottom mold (101), said bottom mold (101) defining a bottom overmold cavity (102) having a bottom surface (101a), said at least one flexible optical circuit (880)...

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Bibliographische Detailangaben
Hauptverfasser: Beers, Megan Hoarfrost, Zitsch, Dwight David, Piper, Henry Burton, Kharel, Aakriti
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A method of preparing an overmolded optical fiber assembly (150) comprising: (a) placing at least one flexible optical circuit (880) in a bottom mold (101), said bottom mold (101) defining a bottom overmold cavity (102) having a bottom surface (101a), said at least one flexible optical circuit (880) having a substrate (881) and a plurality of fibers (882) adhered to said substrate (881), said substrate (881) being disposed at least partly within said bottom overmold cavity (102) to define a first space (801) between said substrate (881) and said bottom surface (101a); (b) flowing a polymer (883) in at least said first space (801); (c) placing a top mold (120) over said substrate (881), said top mold (120) defining a top overmold cavity (121) and a top surface (121a) and a port (122) defined in said top surface (120a) to access said top overmold cavity (121), said substrate (881) defining a second space (802) between said top surface (120a) and said substrate (881); (d) flowing a polymer (884) in at least a portion of said second space (802); and (e) removing said bottom (101) and top (120) molds to release said overmolded optical circuit (150).