SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT

The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a substrate holding and locking method for chemical and/or electrolytic surface treatment of a substrate in a process fluid. The substrate holding and locking system for chemical and/or electrolytic surface treatment comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element. The pump is arranged at the first element and/or the second element, and an additional external reduced pressure system is arranged outside the first element and the second element.