METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED
A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting a...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting an integrated circuit (3) to at least one contact pad (2c) * providing one or more electrically conductive elements (6), * connecting the electrically conductive element or elements (6) to the conductive pads (2b) of the substrate (1) by using an electrically conductive adhesive (7). |
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