LIGHT EMITTING DIODE PACKAGE

A light emitting diode package according to one embodiment of the present invention comprises: a housing including a body part; a first lead; a second lead; a light emitting diode chip; and a Zener diode. The body part has a cavity that is open at the top and has inclined side surfaces. The first le...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PARK, In Kyu, KIM, Byoung Sung, SONG, Jun Myeong
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A light emitting diode package according to one embodiment of the present invention comprises: a housing including a body part; a first lead; a second lead; a light emitting diode chip; and a Zener diode. The body part has a cavity that is open at the top and has inclined side surfaces. The first lead and the second lead are supported by the housing and are disposed apart from each other so as to be electrically insulated. The light emitting diode chip is electrically connected to the first lead and the second lead and mounted within the cavity of the body part. The Zener diode is mounted on one side of the light emitting diode chip and inside the cavity of the body part. Here, the body part is configured such that among the inclined surfaces surrounding the light emitting diode chip, one surface that is adjacent to the Zener diode is a different inclined surface from the other surfaces. According to the present invention, an inclined cover part is formed by covering a region of the light emitting diode package, in which the Zener diode is disposed, with a material containing a reflective substance.