SEMICONDUCTOR PACKAGE HAVING RE-DISTRIBUTION LAYER STRUCTURE ON SUBSTRATE COMPONENT

SEMICONDUCTOR PACKAGE HAVING RE-DISTRIBUTION LAYER STRUCTURE ON SUBSTRATE COMPONENT

A semiconductor package (40) includes a substrate component (100) having a first surface (Si), a second surface (S2) opposite to the first surface (S1), and a sidewall surface (SW) extending between the first surface (Si) and the second surface (S2); a re-distribution layer, RDL, structure (130) dis...

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Bibliographische Detailangaben
Hauptverfasser: CHEN, Chi-Yuan, TSAI, Yi-Lin, HSU, Yao-Pang, CHIU, Shih-Chao, HSU, Wen-Sung, CHIU, Sang-Mao
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package (40) includes a substrate component (100) having a first surface (Si), a second surface (S2) opposite to the first surface (S1), and a sidewall surface (SW) extending between the first surface (Si) and the second surface (S2); a re-distribution layer, RDL, structure (130) disposed on the first surface (Si) and electrically connected to the first surface (Si) through first connecting elements (112) comprising solder bumps or balls; a plurality of ball grid array, BGA, balls (110) mounted on the second surface (S2) of the substrate component (100); and at least one integrated circuit die (300) mounted on the RDL structure (130) through second connecting elements (310).