HOT MELT ADHESIVE

The disclosure relates to a hot melt adhesive composition, comprising (a) at least 60 wt%of an ethylene terpolymer resin containing (i) 55 to 91.5 wt% of units derived from ethylene of the total weight of the ethylene terpolymer resin (a), (ii) 8 to 35 wt% of (C1-6)-alkyl acrylate and/or (C1-6)-alky...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Ek, Carl-Gustaf, Martín-Martínez, José Miguel, Yalalov, Denis, Fuensanta-Soriano, Mónica
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The disclosure relates to a hot melt adhesive composition, comprising (a) at least 60 wt%of an ethylene terpolymer resin containing (i) 55 to 91.5 wt% of units derived from ethylene of the total weight of the ethylene terpolymer resin (a), (ii) 8 to 35 wt% of (C1-6)-alkyl acrylate and/or (C1-6)-alkyl-(C1-6)-alkyl acrylate comonomer(s) of the total weight of the ethylene terpolymer resin (a), and (iii) 0.5 to 10 wt% silane group(s) containing comonomer of the total weight of the ethylene terpolymer resin (a); (b) 5 to 30 wt% of tackifying resin; (c) 0 to 30 wt% plasticizer resin; (d) 0.05 to 10 wt% of crosslinking catalyst; (e) 0 to 3 wt% antioxidant(s); and (f) 0 to 5.0 wt% additives of the total weight (100 wt%) of the hot melt adhesive composition; wherein the melt flow rate (MFR2) of the ethylene terpolymer resin (a) is from 1 to 500 g/10 min as determined according to ISO 1133 and a load of 2.16 kg.