BENDING DEVICE AND BENDING METHOD

A bending apparatus includes a heater that heats a forming plate to be bent; a first pin group including three or more of first pins that contact a first main surface of the forming plate; a first guide plate which supports three or more of the first pins parallel to each other and independently mov...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUDA, Kenichi, FUKUSHI, Takanori, FUNATSU, Shiro
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:A bending apparatus includes a heater that heats a forming plate to be bent; a first pin group including three or more of first pins that contact a first main surface of the forming plate; a first guide plate which supports three or more of the first pins parallel to each other and independently movably supports three or more of the first pins in a longitudinal direction of the first pins; a first movable plate that is arranged on a side opposite to the forming plate with respect to the first guide plate and on which a first mold having a first curved surface that contacts the first pin group is installed; and a first moving mechanism for moving the first movable plate relative to the first guide plate in the longitudinal direction of the first pins.