MOLDING THERMAL EXPANSION STRUCTURE AND MOLDING METHOD THEREOF

A molding thermal expansion structure (20) includes a thermoplastic material (12) and a thermal expansion material (14), wherein the thermoplastic material (12) is 50 wt% to 90 wt% based on a weight of the molding thermal expansion structure (20); the thermal expansion material (14) is 50 wt% to 10...

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1. Verfasser: SU, Chin-Te
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A molding thermal expansion structure (20) includes a thermoplastic material (12) and a thermal expansion material (14), wherein the thermoplastic material (12) is 50 wt% to 90 wt% based on a weight of the molding thermal expansion structure (20); the thermal expansion material (14) is 50 wt% to 10 wt% based on a weight of the molding thermal expansion structure (20); wherein, the thermal expansion material (14) is expanded from a foaming original material through a pre-foaming process; the thermoplastic material (12) and the thermal expansion material (14) are mixed to form a mixed material (10); the mixed material (10) is thermally expanded to form the thermal expansion structure (20) in a mold (30). The molding thermal expansion structure (20) provided in the present invention could satisfy various needs of light-weighted products. A molding method of the thermal expansion structure (20) is also provided herein.