LAMINATE, MOLDED ARTICLE, CONDUCTIVE PATTERN AND ELECTRONIC CIRCUIT

The present invention provides a multilayer body including a substrate (A) including a polyphenylene sulfide resin composition and a primer layer (X), a metal layer (B), and a metal plating layer (C) that are stacked on and above the substrate (A), the primer layer (X) including an aromatic resin (x...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUJIKAWA, Wataru, FUKAZAWA, Norimasa, SHIRAKAMI, Jun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a multilayer body including a substrate (A) including a polyphenylene sulfide resin composition and a primer layer (X), a metal layer (B), and a metal plating layer (C) that are stacked on and above the substrate (A), the primer layer (X) including an aromatic resin (x1) having an epoxy group and a molded article, a conductive pattern, and an electronic circuit that include the multilayer body. The multilayer body includes a polyphenylene sulfide substrate and a metal plating layer stacked above the substrate and has an excellent adhesion strength to the metal plating layer and suitable heat resistance with which an excellent adhesion strength can be maintained even when the multilayer body is subjected to a high-temperature environment.