ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL
A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the f...
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| creator | KIM, Jihong MOON, Hongki KOO, Kyungha JANG, Seyoung YUN, Hajoong LEE, Haejin KIM, Kuntak |
| description | A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability. |
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The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.</description><language>eng ; fre ; ger</language><subject>BLASTING ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER ; COMPUTING ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; COUNTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PHYSICS ; PRINTED CIRCUITS ; SYSTEMS FOR STORING ELECTRIC ENERGY ; TELEPHONIC COMMUNICATION ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240320&DB=EPODOC&CC=EP&NR=3841855B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240320&DB=EPODOC&CC=EP&NR=3841855B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Jihong</creatorcontrib><creatorcontrib>MOON, Hongki</creatorcontrib><creatorcontrib>KOO, Kyungha</creatorcontrib><creatorcontrib>JANG, Seyoung</creatorcontrib><creatorcontrib>YUN, Hajoong</creatorcontrib><creatorcontrib>LEE, Haejin</creatorcontrib><creatorcontrib>KIM, Kuntak</creatorcontrib><title>ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL</title><description>A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.</description><subject>BLASTING</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</subject><subject>COMPUTING</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>COUNTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SYSTEMS FOR STORING ELECTRIC ENERGY</subject><subject>TELEPHONIC COMMUNICATION</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAQgOEsDqK-w72AQ6mFrmdysQfJpaSnaykSJ9FCfX900N3pXz7-tVEKZDUnYQuOLmwJWGw4O5YTIHSECo6HgXtUTvIzPuVIDpIHSRJJMYTPIKJSZgxbs7pN96Xsvt0Y8KS225f5OZZlnq7lUV4j9XV7qNqmOVb1H-QNs14vjw</recordid><startdate>20240320</startdate><enddate>20240320</enddate><creator>KIM, Jihong</creator><creator>MOON, Hongki</creator><creator>KOO, Kyungha</creator><creator>JANG, Seyoung</creator><creator>YUN, Hajoong</creator><creator>LEE, Haejin</creator><creator>KIM, Kuntak</creator><scope>EVB</scope></search><sort><creationdate>20240320</creationdate><title>ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL</title><author>KIM, Jihong ; MOON, Hongki ; KOO, Kyungha ; JANG, Seyoung ; YUN, Hajoong ; LEE, Haejin ; KIM, Kuntak</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3841855B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</topic><topic>COMPUTING</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>COUNTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SYSTEMS FOR STORING ELECTRIC ENERGY</topic><topic>TELEPHONIC COMMUNICATION</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Jihong</creatorcontrib><creatorcontrib>MOON, Hongki</creatorcontrib><creatorcontrib>KOO, Kyungha</creatorcontrib><creatorcontrib>JANG, Seyoung</creatorcontrib><creatorcontrib>YUN, Hajoong</creatorcontrib><creatorcontrib>LEE, Haejin</creatorcontrib><creatorcontrib>KIM, Kuntak</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Jihong</au><au>MOON, Hongki</au><au>KOO, Kyungha</au><au>JANG, Seyoung</au><au>YUN, Hajoong</au><au>LEE, Haejin</au><au>KIM, Kuntak</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL</title><date>2024-03-20</date><risdate>2024</risdate><abstract>A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| source | esp@cenet |
| subjects | BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER COMPUTING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS SYSTEMS FOR STORING ELECTRIC ENERGY TELEPHONIC COMMUNICATION WEAPONS |
| title | ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL |
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